New high-performance M.2 NVMe 2.0 SSDs with PCI Express 5.0 interface coming onto the market have significantly higher cooling requirements than established SSDs with PCIe 4.0 technology. Typically, when a new technology hits the market, many vendors look to quickly push the limits of performance in sequential and random access, even if it means high temperatures that can cause thermal throttling and other issues.
We have already seen cooling solutions of all kinds for PCIe Gen 5 SSDs, even with liquid cooling, and now TeamGroup has shown us their own T-FORCE DARK AirFlow NVME 2.0 SSD. By using the PCIe Gen 5 x4 interface, these SSDs will exceed 10 GB/s of sequential read and write. The company has not revealed specific details about its speed, but it will be its highest and fastest range.
To keep its temperatures under control, it includes a large heatsink made up of several aluminum fins crossed by two copper heatpipes in charge of cooling the memory chips and the controller of the SSDs on which it is used.
Along with these SSDs, TeamGroup has shown us other cooling solutions of different types to cool SSDs, some with passive dissipation and others with a built-in fan.
This model has a fairly high tower design, not suitable for compact equipment.
This other model transfers heat through a large copper heatpipe to a tubular upper heatsink, in addition, at the base the heatpipe is covered by a metal block that also helps dissipation.
The T-Force Carder Aluminum is a completely passive heatsink SSD with a more contained design thanks to the use of the slower PCIe 4.0 interface.
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Anthony Delgado
Computer Engineer by training, writer and hardware analyst at Geeknetic since 2011. I love gutting everything that comes my way, especially the latest hardware that we receive here for reviews. In my free time I mess around with 3d printers, drones and other gadgets. For anything here you have me.
