Device manufacturers cooling for Intel LGA1700 CPUswhether air, custom blocks or AiO liquid cooling, are announcing that your current solutions for LGA1700 they will also be valid for the next Intel with LGA1851 socket. For this to be effective, the hottest point of these Intel Arrow Lake for desktops it has to be similar. According to well-known overvlocker der8auerthis hot spot in the new Intel will be moved up.
According to the overclocker’s words, the hot point in these Intel LGA1851 will be located further north than in the LGA1700. This is something that CPU cooling manufacturers have to take into accountsince a change in this area can reduce cooling capacities of your devices, and a 180º turn can be worse. To obtain a optimal performance In liquid cooling, the cold water inlet should be located in the topreceiving the newly cooled liquid in the hottest part, and the exit at the bottom that carries the hot liquid to the radiator.
New CPU layouts with multiple tiles They may have different areas where the temperature can be raisedalso Intel can offer different matrices for their ranges of processors, with different hot spots within the same generation of processors. This is something that refrigeration manufacturers must adjust when it comes to offer the best solution for this new generationeven keeping the same socket size. We will be able to know How do current solutions work? cooling for LGA1700 in these new LGA1851 when Intel releases the embargo, presumably on October 24.
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Juan Antonio Soto
I am a Computer Engineer and my specialty is automation and robotics. My passion for hardware began at the age of 14 when I broke down my first computer: a 386 DX 40 with 4MB of RAM and 210MB of hard drive. I continue to give free rein to my passion in the technical articles I write for Geeknetic. I dedicate most of my free time to video games, contemporary and retro, on the more than 20 consoles I have, in addition to the PC.
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