![[Img #74664]](https://thelatestnews.world/wp-content/uploads/2024/12/James-Watson-The-controversial-genius-behind-the-double-helix-150x150.jpg)
Today we were talking about the performance of the Intel Core i9-13900K to a single corebut as we can read on Twitter, it is not the only leak that has taken place today, as it has also been seen the design of the new case for the Intel Core i9-13900K.
It is unknown if this box will be like this for the rest of the processors in the K range, but what is clear is that for this new generation of processors It will have a size that will make it clear that the chip comes without a heatsinkbecause in the case of the previous generation, the wafer-shaped casing was placed so that the box increased in size.
In this generation of these processors, the wafer-shaped case will still be in the box, but it will arrive arranged in such a way that the thickness of the case is significantly reduced, providing various improvements in chip logistics, such as higher packing density in shipments.
For the rest, the rest of the details of the box seem to remain the same as those of the previous generation, so there’s not much news on that front, although the image has a watermark that would indicate that On the 28th of this month we will have news.
End of Article. Tell us something in the Comments!
Jordi Bercial
Avid technology and electronics enthusiast. I’ve been messing around with computer components almost since I could walk. I started working at Geeknetic after winning a contest on their forum about writing hardware articles. Drift, mechanics and photography lover. Feel free to leave a comment on my articles if you have any questions.
Add Comment