Qualcomm brings support for dynamic spatial audio to wireless headphones

November 17 (Portaltic/EP) –

Qualcomm has upgraded Snapdragon chips designed for the new generation of wireless headphonesincluding support for dynamic spatial audio and improvements for lossless music streaming.

The technology manufacturer has held its annual Snapdragon Summit 2022 event this week, in which it has unveiled the new Snapdragon 8 Gen 2 processor for high-end smartphones and another for augmented reality glasses, Snapdragon AR2 Gen 1.

It has also updated the audio platforms with the new S5 Gen 2 and S3 Gen 2 chips, that they have designed to offer “the rich features that consumers want most”, as the company has pointed out in a press release.

These features include support for the spatial audio with dynamic head trackingthe Lossless audio for connections with Bluetooth LE Audio and one lowest latency in video games, from 48 seconds between the ‘smartphone’ and the headphones.

Both chips are also compatible with the third generation of the technology of adaptive active noise cancellation from Qualcomm, which adapts “both to the fit in the ear and to the user’s external environment.”

The S5 Gen 2 and S3 Gen 2 chips will arrive integrated in the wireless headphones that are marketed in the second half of 2023.