Based on an asymmetric design octa-core and manufactured using a 3nm process, the Dimensity 9400 CPU is made up of an ARM Cortex-X925 core to execute high-performance tasks supported by three general-purpose ARM Cortex-X4, as well as four high-efficiency Cortex-A720. According to MediaTek, this composition makes its new chipset It is 40% more efficient than its previous flagship, which does not mean that it consumes 40% less.
The GPU is also new, based on ARM’s latest design: it’s the Immortalis-G925. According to the data provided by ARM itself, this graphics processing unit can provide a 15% performance improvement, although as always, MediaTek and its partners play a lot with factory values when adjusting performance and consumption, so we will have to wait for the benchmarks to find out how it works.
More interesting if possible is the detail that this chipset has been specifically designed to handle the graphics of the new wave of bi-fold phones, also known as tri-fold due to the division of the screen into three segments, implying that Huawei will not be the only manufacturer with a mobile phone of these characteristics in the short term. Also due to the inclusion of a new, much more advanced eighth-generation NPU, with LoRA training on the device itself, AI-generated video acceleration, and support for Agentic, which is possibly the next frontier in local AI processing, making it easier to realize of very complex jobs without the need to delegate them to the cloud.
For the rest, the Dimensity 9400 also integrates a Wi-Fi/Bluetooth module with consumption reduced by no less than 50%, support for MLO tri-band wireless networks and with an improved Wi-Fi range of up to 30 meters.
As MediaTek points out in its press release, the first phones with its new chipset They will hit the market during the fourth quarter of 2024, which is the same as saying that they will be announced first in China between now and December and we will see them in the West between CES and the Mobile World Congress.
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