Kioxia, the company formerly known as Toshiba Memory, is one of the leading manufacturers of 3D NAND memory with its BiCs chips of different generations.
Now, in its roadmap, the company hopes to be able to have 1,000-layer vertically stacked 3D NAND (V-NAND) memory chips in just 3 years, by 2027These expectations are based on the evolution of this market in recent years, with a trend that is constantly multiplying the density of chips. Specifically, with an increase of 1.33x per year.
In addition to this increase in chip density, the company also plans to further reduce the size of memory cells, even moving from 3-bit TLC memory to 4-bit QLC and even 5-bit PLC memory.
It seems that in the collaborative partnership between Kioxia and Western Digital there are some discrepancies on the viability of this evolution in such a short term. WD points out that the investment costs are very high, and that the increase in chip density leads to a slow cost reduction over time. Therefore, the company’s bet in this regard is to slow down the development of chips with more and more layers in the coming years.
Kioxia, for its part, is seeking to challenge Samsung for leadership in the NAND memory chip market by increasing its density. It remains to be seen whether the two companies can come closer together.
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Antonio Delgado
Computer Engineer by training, editor and hardware analyst at Geeknetic since 2011. I love to dissect everything that passes through my hands, especially the latest hardware that we receive here to do reviews. In my free time I tinker with 3D printers, drones and other gadgets. For anything you need, here I am.
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