The collaboration between Kioxia and Western Digitaltwo storage giants around the world, is paying off with new factories for the production of flash memory with the latest technology. Now have presented fruit of this collaboration, the 218-layer FLASH memory which has been launched earlier than stipulated by the companies thanks to the same R&D roadmap and the continuous investment by Kioxia and Western Digital in this sector.
the new memory 218-layer 3D FLASH features TLC and QLC technology triple and quadruple level respectively. It also offers as a novelty lateral contraction technology that increases bit density by 50%. This new memory is able to offer up to 3.2Gb/swhich translates into a 60% more than the previous generation and is also capable of increasing the performance of reading and writing in up to 20%.
For the manufacture of this new memory 8th generation BiCS FLASH cost has been reduced by introducing new technologies for wafer manufacturing, balancing between vertical and lateral scaling to produce higher capacity in smaller dies and fewer layers. This translates into a more optimized costwhere in addition CMOS and the cell matrix are manufactured separately for then stitch them together and improve the bit density with faster I/O.
The first samples have already been sent to customers so they can test this new 218 layer memory.
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Juan Antonio Soto
I am a Computer Engineer and my specialty is automation and robotics. My passion for hardware began at the age of 14 when I gutted my first computer: a 386 DX 40 with 4MB of RAM and a 210MB hard drive. I continue to give free rein to my passion in the technical articles that I write at Geeknetic. I spend most of my free time playing video games, contemporary and retro, on the 20+ consoles I own, in addition to the PC.
