iPhone 17 will arrive with Apple’s first WiFi chip, according to Kuo

Nov. 1 (Portaltic/EP) –

Apple plans to equip its next generation of smartphones, iPhone 17from a self-developed chip with support for WiFi connectivityan option that will allow it to reduce costs and improve the integration of its ecosystem, according to analyst Ming-Chi Kuo.

In January 2023, Bloomberg journalist Mark Gurman announced that the American company was fracking its own processors to achieve a combined component that included WiFi and Bluetooth functions.

Thanks to this work, Apple would replace the chips of its current supplier, Broadcom – which supplies the component that makes WiFi and Bluetooth functions possible on Apple devices-, and would move closer to its plans for independence in production to begin implementing them in 2025.

However, Kuo noted days later that the firm had made the decision to paralyze the development of these components “for a while”, without anticipating the duration of this pause. Gurman, however, stressed that he had paused the development of the chip with only WiFi and not the one that It combined this connection with Bluetooth.

Kuo has now progressed through his account X staff that Apple will equip its next series of ‘smartphones’, iPhone 17, It will arrive with its self-developed WiFi and Bluetooth chips in the second half of next year.

These components will be manufactured using Taiwan Semiconductor Manufacturing Company’s (TSMC) N7 process and will be compatible with the latest specification. Wi-Fi 7, as the analyst has been able to know.

With this movement, therefore, the Cupertino firm “will reduce production costs and will improve the integration advantages of its ecosystem”, since in addition to the iPhone, it will gradually use them “in new products simultaneously.”

Finally, Kuo has made reference to what will be the next iPhone SE 4, which will feature the first Apple 5G modemas advanced earlier this month 9to5Mac, although it will continue to use a Broadcom WiFi chip and will arrive in spring 2025.