The Chinese company Huawei this planning enter the HBM memory manufacturing market. This type of “high bandwidth” memories are enjoying a boom due to the expansion of GPUS and other acceleration systems for AI systems. The latest AMD Instinct accelerators, the equivalent models from NVIDIA, etc. All cutting-edge hardware oriented towards AI processing is using these memories that companies such as Samsung or SK Hynix are working hard to manufacture with higher speeds and capacities.
In order to compete with them, Huawei will join forces with another company from the Asian country called Wuhan XMC, as well as a group of local companies such as JCET and Tongfu Microelectronics. The idea is that in the year 2026 they can begin manufacturing this type of HBM memories and take advantage of the AI boom before it’s too late.
If achieved, it would be another step towards China can achieve some independence from Western hardware, a key point for its economy after the numerous sanctions imposed by the US and other countries, which have left many local companies without access to the most cutting-edge hardware.
This information is consistent with previous reports that Huawei has been trying to create a supply chain in China for the manufacture of HBM for some time.
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Antonio Delgado
Computer Engineer by training, editor and hardware analyst at Geeknetic since 2011. I love to dissect everything that passes through my hands, especially the latest hardware that we receive here to do reviews. In my free time I tinker with 3D printers, drones and other gadgets. For anything you need, here I am.
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