Bose will adopt Qualcomm Sound S5 chips in its next audio solutions

Announced at MWC 2022, the platforms Qualcomm Sound S5 They are part of Qualcomm’s proposal to be integrated into wireless audio devices that seek to offer high sound quality and low latency.

These chips integrate Dual Bluetooth 5.3 connectivitywith low energy mode, together with the processor itself, DSP, noise cancellation systems, lossless audio codec processing and even Artificial Intelligence to turn speakers and headphones into smart devices that do not require cables to achieve high sound quality.

At the IFA 2022 kick-off ceremony, Cristiano Amon, CEO of Qualcomm, and Lila Snyder, CEO of Bose, have announced a collaboration agreement by which the well-known manufacturer of audio solutions will integrate the Snapdragon Sound S5 on your next devices.

In this way, they promise the launch of wireless headphones and speakers that consume very little energy, but are capable of offering CD quality without the need for cables, in addition to taking advantage of the low latency that this SoC achieves for games, calls and all kinds of uses. .

This will also include systems with support for calls with optimizations and noise cancellation, along with all the technologies supported by the S5 SoC.

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