Bosch wants expand its semiconductor manufacturing business with silicon carbide chipswhich is why it is planning the acquisition of TSI Semiconductors, an American foundry with 250 workers that mainly uses 200mm diameter wafers for the manufacture of chips for the mobility, telecommunications and energy industries.
During the next few years, Bosch plans to invest 1.5 billion dollars at the Roseville factory to update it to the latest processes, so that, from 2026, the first chips would begin to be manufactured on 200mm wafers based on silicon carbide.
Although it is not expected that Bosch enters the computer segment, it is true that there are many components manufactured by the company, for example, some sensors that we find in smartphones, as well as hundreds of chips that we can find in vehicles around the worldsomething that the brand wants to take advantage of to strengthen its presence in the electric vehicle market.
Additionally, Bosch announced last summer the investment of 3 billion euros in its factories in Europe, present in Germany (Reutlingen and Dresden) and that they add to the 2.5 billion euros already invested in the 200mm diameter wafer technology.
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Jordi Bercial
Avid technology and electronics enthusiast. I tinkered with computer components almost since I could walk. I started working at Geeknetic after winning a contest on their forum for writing hardware articles. Drift, mechanics and photography lover. Do not hesitate and leave a comment on my articles if you have any questions.
