AMD has today shown the characteristics of the new motherboards for Ryzen 7000 CPUs

AMD has officiated today a Webinar in which motherboards from different manufacturers have been seenand thanks to this, we can know both information about the specific models of brands such as ASUS or MSI, as well as general information of the new platform on which the new AMD Ryzen 7000 Series processors will reside.

AMD has started in a very direct way, showing some of the specifications of the new AMD AM5 socket, which has a new LGA design that departs from the PGA socket that AMD has been using until now in home computers. This socket comes with a total of 1718 pins, and has native support for processors with up to 170W TDP.which means that the next generation top processors will arrive with the maximum TDP for the platform.

This does not imply that the processors cannot consume more than 170W, Well, it is something that is going to happen, especially if we choose to manually overclock the processor. However, it also makes it clear that, barring a revolution in the next Zen architectures, it will be difficult to see how the number of cores doubles, just like it happened in AM4.

As expected, AM5 arrives with support for DDR5 memory and PCI Express 5.0so that we can connect both the latest generation RAM and graphics cards and storage units with breakneck speeds, taking full advantage of the capabilities of AMD Ryzen processors.

Total, socket AM5 supports up to 24 PCI Express lanes, up to 14 USB ports at 20Gbps, WiFi 6e connectivity, and up to 4 HDMI 2.1 or DisplayPort 2.0 portsthus being a platform with interesting connectivity possibilities, which will also be expanded depending on the chipset we choose.

Speaking of chipsets, AMD today has only talked about the AMD X670 and X670E, leaving the mid-range and low-end options in the pipeline for a future event, as happened with the 500 series chipset. As we already knew, X670 has enthusiast overclocking capabilities, a PCI Express 5.0 NVME slot and the possibility of having a PCI Express 5.0 slot for graphics, although it is not mandatory.

On the other hand, in the case of the X670E chipset, the overclocking capabilities are increased, thus becoming the preferred option for extreme overclockers who require every ounce of adjustability, as well as ensuring PCI Express 5.0 connectivity to one NVMe slot as well as two PCI Express x16 slots.

If we take a look at the motherboards announced by the different companies, we can see how it is common to find a huge number of USB 3.2 ports, both Gen 2 type and Gen 2×2 type, in addition to seeing the appearance of USB 4.0 on the back of these new models.

Likewise, at the level of network connectivity, it is not uncommon to find 2.5Gbps adapters, and even some 10Gbps ones. That is why for the high end of AMD, 2.5Gbps adapters can be considered the new standard after many years of glory for Gigabit Ethernet adapters, who are beginning to succumb to even the best fiber optic connectivity rates.

Another standard that seems to have an expiration date is M.2. 2280, because in some cases we are seeing how high-performance PCI Express 5.0 SSDs can arrive with an M.2 form factor. 25110wider and longer than usual, something that in addition to indicating a greater generation of heat -and therefore larger heat sinks-it may mean we see capabilities never seen before in this form factor.

End of Article. Tell us something in the Comments!