Qualcomm will not make chiplets at the moment for cost reasons

The design of chiplets has gained strength in the market for desktop processors and GPUs. Companies like AMD first with its Ryzen 3000 and Intel (Foveros for example) later have switched to this processor design and packaging system where key components are divided into distinct “Dies” that are combined under a single substrate in the processor. This technology allows different manufacturing processes to be combined in the different components and unified in a highly scalable design, both in 2D and with 3D stacking.

However, while there are cost advantages to this design on PCs (it’s easier to make smaller chips, and larger, cheaper nodes can be used for components like I/O), it’s not applicable in all markets, and Qualcomm is not going to bet for the moment on the design of chiplets in its SoCs for smartphones and PCs.

The reason is none other than the increase in costs that would entail manufacturing a SoC using chiplets in such a contained size like the one that processors for smartphones have. Although in this type of chips a reduction in consumption could be achieved Switching to this design, the increased costs of adapting such a package to mobile SoCs would not compensate the company.

So he has assured us Alex KatouzianSenior Vice President and General Manager of Qualcomm’s Mobile, Compute and XR divisions in this Computex 2023.

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