Akasa has launched a new heatsink for the Intel LGA 1700 socket that will allow users of the most compact computers on the market to have a cooling solution that allows, at least, have a processor with a low TDP (35W according to Akasa) inside a chassis that generally does not support large doses of performance.
This will also be useful in industrial chassis, where standards sometimes fly out the window and you work as best you can with the available space, thanks to The Akasa AK-CC6609EP01 arrives with a thickness of only 21.8mm, less than the 25mm thickness of a hockey puck.
The construction of this heatsink is similar to what we can find in the original heatsink for LGA1700, since it is an extruded aluminum construction with a nickel plated copper basesomething that will ensure great longevity in various environments.
In the center of the heatsink, embedded in the aluminum blades, we find a fan with a diameter of 75mm capable of pushing up to 23.45CFM of air with a sound level of 30.75dBA at speeds between 600 and 3000RPM. The price of the heatsink is unknown.
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Jordi Bercial
Avid technology and electronics enthusiast. I’ve been messing around with computer components almost since I could walk. I started working at Geeknetic after winning a contest on their forum about writing hardware articles. Drift, mechanics and photography lover. Feel free to leave a comment on my articles if you have any questions.
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