TSMC announces the construction of seven new plants to boost its global competitiveness

Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chipmaker, will build seven new plants this year in an effort to boost its global competitiveness. He advertisement was made on Thursday by Huang Yuan-kuo, director of the Tainan FAB18 plant, during the TSMC 2024 Taiwan Technology Symposium.

The new facilities include three wafer and two packaging fabs in Taiwan, plus two additional plants overseas. These builds are designed to meet the growing global demand for high-performance computing devices and smartphones.

Huang highlighted that due to strong demand, TSMC’s three-nanometer process production capacity is expected to triple this year compared to 2023. In addition, TSMC is expanding its specialized technology production capacity. The share of specialized technology in relation to all mature processes is expected to increase to 67% in 2024, up from 61% in 2020.

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Regarding automotive platform solutions, TSMC anticipates a compound annual growth rate of 50% between 2020 and 2024. This underlines the company’s commitment to innovation and the development of advanced technologies for various industries.

Huang also reported that two new wafer plants, which are being built in Hsinchu and Kaohsiung from 2022, will make two-nanometer chips. Series production at both plants will begin in 2025. In addition, construction of an advanced packaging factory in central Taiwan began last year, and another plant in Chiayi is scheduled to begin later this year, kicking off production. in mass of Chip on Wafer on Substrate (CoWoS) and Small Outline Integrated Circuit (SoIC) technologies in 2026.

This ambitious expansion plan underscores TSMC’s position as a leader in the semiconductor industry and its commitment to meeting the growing demand for advanced technology globally.