Memory manufacturers are working on Next Generation of the memory of high bandwidthalso known as HBM. Samsung has announced which is developing the HBM4 memory for its arrival during 2025 and the other manufacturers have not wanted to be left behind. SK Hynix has announced an agreement of collaboration with TSMC for the development and packaging of HBM4 memory, something that It had been rumored before. With this agreement it is intended that the memory SK Hynix's HBM4 to be available for mass production in 2026.
The memory manufacturer wants improve HBM4 logic and advance its performance in collaboration with TSMC. For this both will improve the performance of the base die from the bottom, and that a DRAM core is stacked on top using a TSV connection with a fixed number of DRAM layers. For this HBM4 SK Hynix memory will adopt a TSMC advanced process for coreWhich will allow personalize the memories as needed performance or efficiency. They will also collaborate to integrate CoWos from TSMC in SK Hynix's HBM memories.
The manufacturer hopes that with this collaboration memory will be manufactured Market-leading HBM4surpassing the solutions of other manufacturers such as the one presented by Samsung, and being the ideal solution for the demand for applications for Artificial Intelligence that is looming for the future.
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Juan Antonio Soto
I am a Computer Engineer and my specialty is automation and robotics. My passion for hardware began at the age of 14 when I broke down my first computer: a 386 DX 40 with 4MB of RAM and 210MB of hard drive. I continue to give free rein to my passion in the technical articles I write for Geeknetic. I dedicate most of my free time to video games, contemporary and retro, on the more than 20 consoles I have, in addition to the PC.
