Some time ago, we knew that TSMC had acquired 30 hectares for the construction of a new factory with advanced node. The works began in the year 2020 and finally TSMC has announced the opening of this new factory, which they have called Advanced Backend Fab 6. This new factory is available to expand the 3D stacking technologywhich is so present now, called 3DFabric.
This factory will integrate the entire manufacturing process with 3DFabric technology, in addition to testing services. Is ready for technology TSMC-SoIC and allows you to flexibly allocate capacity for stacking technologies, such as SoIC, InFO or CoWoSWith advanced tests. This factory will have the capacity to manufacture up to 1 million 12-inch wafers along with more than 10 million service hours per year. With this factory, TSMC wants to position itself as a leader for the manufacture of wafers with this 3D Fabric technology with which you can cover the growing demand.
The factory has a surface of almost 15 hectares, being the largest of its kind, and where it has a clean room area greater than the sum of the rest of TSMC’s advanced factories. TSMC’s five-in-one intelligent automatic system enables a increased manufacturing efficiency, and has a length of 32 kilometers. Also available connected artificial intelligence systemswhich allow monitoring of the entire manufacturing process to detect anomalies in real time.
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Juan Antonio Soto
I am a Computer Engineer and my specialty is automation and robotics. My passion for hardware began at the age of 14 when I gutted my first computer: a 386 DX 40 with 4MB of RAM and a 210MB hard drive. I continue to give free rein to my passion in the technical articles that I write at Geeknetic. I spend most of my free time playing video games, contemporary and retro, on the 20+ consoles I own, in addition to the PC.
