Seasonic’s OptiSink design uses a new PCB to improve MOSFET dissipation in much less space

Seasonic has presented at Computex a revolutionary motherboard design technology called OptiSink. This is a new layout system for the PCB and its materials that considerably reduces the size of the MOSFETs and avoids the need to use large heatsinks.

At its Computex stand, the company has shown us this technology in detail, even with sectional cuts of the previous and current system, where you can clearly see the difference between the distribution of the PCB and the MOSFETs with their heatsinks.

In the following photograph we can see a traditional design of MOSFETS attached to a dissipation plate.

In the cross section, you can see the space occupied by the MOSFET, including its internal terminals, and the screw that fixes it to the heatsink. We can see that it is a svoluminous solution that requires a heatsink of considerable dimensions.

With Seasonic’s new OptiSink design, The MOSFETs have been reduced in size and are fixed directly to the PCB. In addition, the PCB itself is made of new materials and acts as a heatsink, avoiding the need to place a large extra heatsink with its screws and saving space.

The first lines of sources that receive this technology are the Seasonic FOCUS and the Seasonic CORE Series, improving their efficiency and durability.

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