Samsung is already working on its HBM4 memories with 16 layers for 2025

Samsung is developing your next HBM4 memories to prepare for its arrival during the year 2025. These modules will replace the current HBM3e and will reach up to 16 stacked layersin addition to having chips with 8 and 12 layers for different uses in all types of devices.

Samsung's 16-layer HMB4 memories could reach up to 256 GB capacity on a GPU (if the same 24 Gigabit modules are used) with a bandwidth considerably higher than the 10 Gbps of current generations.

With 256 GB of capacity, it is expected that the first devices that make use of this technology will be, for example, AI accelerator graphics cards as the successors (or updates) of the NVIDIA Blackwell B200 or AMD Instinct MI300. Being able to go from 192 GB to 256 GB in the same space and with the same number of chips.

HBM4 memories could also adopt 3D manufacturing technology. They are currently manufactured in a combination called 2.5D, but a jump to fully 3D packaging would be the next logical step.

At the moment there are not many more details and not even the code name that these Samsung HBM4s will have has been revealed. The previous generations were called Flarebolt and Aquabolt (HBM2), Flashbolt (HBM2E), Icebolt (HBM3) and Shinebolt (HBM3E).

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